3D AOI for IC industry Grows Fast With CAGR of 20.05% 

3D AOI is a new type of inspection technology that originated in emerging markets, but is evolving rapidly. Many manufacturers have introduced his AOI test equipment. 3D AOI enables accurate inspection and measurement of height dimensions of devices on PCBs, providing clear side views of ICs and various devices.
3D AOI has become the norm in recent years as assembly complexity increases, component miniaturization increases, and demands for lower spurious error rates increase. Its purpose is to make a more authoritative statement about the quality reality of solder joints, components, etc. A pure 2D image only determines one color value, while 3D provides valuable height information in addition to the X and Y values.

Global 3D AOI for IC Market was valued at US$33.36 million in 2020 and is projected to reach US$132.62 million by the end of 2028, growing at a CAGR of 20.02% from 2022to 2028 It has been.

Koh Young Technology, Test Research, ViTrox Corporation Berhad, Saki Corporation, Cyberoptics Corporation, Omron Corporation, Viscom, Mirtec, Parmi Corp, VI Technology (Mycronic), GOEPEL electronic GmbH, Mek Marantz Electronics, Nordson YESTECH are leading the IC market Global 3D AOI for.

Currently, the 3D AOI industry is generally at a more advanced level in developed countries. The world’s largest companies are mainly concentrated in South Korea and other Asian countries. On the other hand, foreign companies have more advanced equipment, strong R&D capabilities, and cutting-edge technology levels. However, the manufacturing costs of foreign companies are relatively higher than those of Chinese companies. With the development of China’s 3D AOI production technology, its share in the international market has increased, and its competitiveness in the international market has gradually increased.

Koh Young Technology, Test Research and ViTrox Corporation Berhad are the top three players in the world. The three companies accounted for 43.95% market share in 2020.

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